May 30, 2023
Acer, Yeni Hepsi Bir Arada Masaüstü ve Dizüstü Bilgisayarlarla Aspire Serisini Genişletiyor

SHANGHAI, January 6, 2023 /PRNewswire/ — In the long term, folks will witness the inevitable rise of extremely built-in, skinny and miniature digital terminal merchandise. Geared up with the thirteenth era Intel Raptor Lake processor, launched by ASUS at CES 2023, the brand new era Zenbook is the primary digital system to characteristic built-in modularization of the CPU and reminiscence circuits. USI and ASUS labored carefully collectively through the growth of this new product, designed by ASUS and manufacturing providers supplied by USI. USI utilized System-in-Bundle (SiP) expertise to the CPU module for the primary time.

SiP CPU Module
SiP CPU Module

“We needed to take care of many challenges associated to the method of large-size and high-speed sign modules, comparable to warp management, module testing and growth supporting ultra-high variety of pins, and so forth. We’re pleased to have this chance. Simulation, construction design, course of growth in order that we are able to present clients with value-added merchandise. and collaborating with ASUS in creating the CPU module all through all the process from manufacturing.” John Fangstated the USI CTO.

” ASUS Zenbook has at all times been dedicated to creating main applied sciences and offering customers with a superb expertise. Working with USI, we used superior module processing functionality to innovate the business’s first SiP CPU module and notice the modularization and miniaturization of the pocket book core. Skinny, mild, moveable and extremely It completely presents the environment friendly Zenbook to the world.” rex leeASUS Company Vice President and Head of Private Computing Enterprise Unit, stated.

Shoppers search for thinness and excessive effectivity when selecting a laptop computer. The calls for of the shoppers affect the business when it comes to design, workmanship, supplies, and so forth. push ahead in product optimization by means of innovation.

USI offers module design and miniaturization course of expertise to help ASUS in shortening the high-speed sign path between processor and reminiscence to fulfill Zenbook’s excessive efficiency demand. To scale back the complexity and price of the motherboard and shorten the product design cycle, a shared SiP CPU module design is used that may assist the CPU and reminiscence configurations required by totally different merchandise. That is the primary CPU and reminiscence integration module for high-performance laptops, decreasing motherboard measurement by 38% with a complete pin depend of three,384.

The event development of shopper electronics in direction of miniaturization is growing the demand for SiP expertise. With years of efforts in SiP expertise, USI offers module merchandise for varied functions comparable to wi-fi communication, Web of Issues, wearable units, electrical automobiles, serving to our clients to implement product options comparable to excessive effectivity, thinness and lightness, low weight. energy consumption, low latency and so forth.

About USI

USI (SSE: 601231), Common Scientific Industrial (Shanghai) Co., Ltd. is a world chief in digital design and manufacturing in addition to a pacesetter in SiP (System-in-Bundle) modules. USI offers D(MS)2 product providers: Ddesign, Mmanufacturing, Mstartup, Industrial software program and {hardware} Soptions and provides, logistics and upkeep Sproviders. With asteelflashUSI has 28 gross sales, manufacturing and repair factors on 4 continents. Asia, EuropeAmerica and Africaaffords buyer diversified merchandise within the wi-fi communications, computing and storage, shopper, industrial, medical and automotive electronics industries worldwide. USI is a subsidiary of ASE Know-how Holding Co., Ltd. (TWSE: 3711, NYSE: ASX). To be taught extra, please go to and work together with us LinkedIn and YouTube.

Copyright © acrofan All Rights Reserved

#SiP #CPU #Module #USI #Geared up #ASUS #Zenbook

Leave a Reply

Your email address will not be published. Required fields are marked *